New designed semiconductor processing furnace has a quick heating/cooling response and realizes a homogenized temperature distribution on entire wafers.

Specifications

Heater outer size (H/OD/ID) 1,100mm/φ480mm/φ335mm
Heat zone 4 Zones
Thermocouples (TCs) Installed from side walls
(four TCs are for temperature control,
another four TCs are for protection of overheat)
Thermal insulator material Outer : Fine flextime paper
Inner : High purity fiber mold
Heater material/shape KANTHAL APM / Wave-shaped
Heater connection circuit Parallel circuit
Terminal Upper side: 2, Lower side: 3
Others: one φ11mm hole
Maximum power supply 38.0kVA
Outer case material SUS304 (t=1.5mm)
Accessories Thermocouple fixing metal